Top PCB Manufacturers and Exporters, Printed Circuit Board Manufacturer & Exporter In India
Our Services
Printed Circuit Board (PCB)
We offer prototypes and high-volume production in our Ahmedabad, Gujarat, and Vadodara, Gujarat, facilities. Manufacturing includes single-sided, Metal core, and multi-layer constructions using an array of base
materials. Upon request, our global partners are an option based on lead times and pricing requirements.
Our 60,000 sq.ft. full-service PCB solution provider at our headquarters in Ahmedabad is capable of manufacturing over 180,000 sq. mtr. of panels per annum. Within this facility, our manufacturing processes are continuously upgraded with new equipment to allow us to stay current with the newest technologies.
PCB Capabilities
Production Capabilities (Rigid, Flex and Rigid-Flex)
- Layers: 1 - 40
-
Smallest Trace/Space: 3/3 mils Smallest PadSize: 3 mils
- Min. Aspect Ratio: 12:1
- Board Thickness: 20-250 mils
- Minimum 0.4 mm BGA Pitch
- LOI Solder Mask Registration
- Plated Edges / Castellations
- Multiple Plating
- Min. Solder Mask Between Pads: 2.5 mils
- Min. Core Thickness: 2 mils (without copper), 5 mils (with copper)
- Smallest Drill Size: 3 mils (Mechanical), 3 mils (Laser)
- Smallest Finished Hole Size: 2 mils (Mechanical), 2 mils (Laser)
- Vias: Blind, Buried, In Pad, Via fill
- Impedance Tolerance: 5%
- Impedance Control
- LOI Inner/Outer Layer Imaging
- High Copper Weight
- Via Fill-conductive / non-conductive
- Control Depth Routing
- Technical Assistance
-
Largest Panel Size:
22” x 48” {Single-sided & MetalCore PCBs)
22” x 48” {Double-sided PCBs)
22” x 26” (Multi-Layer PCBs)
-
Materials:
FR-4 (Low Tg, or High Tg, UL Approved)
Megtron 6
Potyimide
Rogers Ceramic & Duroid
Halogen-free
Taconic Nelco
Arion / Arion Flex High Frequency Panasonic
-
Metal Core:
Aluminium Core 6061
Aluminium Core 5052
Copper Core
Copper-Invar-Copper
-
Hybrids:
Metal-Backed Rogers Duroid
Metal-Backed Robers Ceramics
Metal-Backed FR-4
-
Surface Treatments:
HASL (lead or lead-free):
ENIG :
Gold Plating :
Immersion Thin:
Immersion Silver :
OSP
-
Solder Mask:
Green, White, Orange, Blue Red, Black, Yellow, Customer Colors
-
Rigid-Flex & Flex:
Sculpted Fingers
impendence Control
Dynamic Flexing
Fine Lines
Cavity Boards
Wire Bondable
Strip lines
Micro Strip Lines
Cryo-Stable (as low as-200C Liquid Nitrogen/Rigid-Flex)
Crye-Stable (as low as-273C Liquid Nitrogen/Flex)
- Layers: 1-40
- Impedance Tolerance : 5%
- Smallest Trace/Space: 3/3 mils Smallest PadSize: 3 mils
- Impedance Control
- Min. Aspect Ratio: 12:1
- LOI Inner/Outer Layer Imaging
- Board Thickness: 20-250 mils
- High Copper Weight
- Minimum 0.4 mm BGA Pitch
- Via Fillconductive/non-conductive
- LOI Solder Mask Registration
- Control Depth Routing
- Plated Edges/Castellation’s
- Multiple Plating
- Minimum Solder Mask Between Pads: 2.5 mils
- Min. Core Thickness: 2mils (without copper), 5 mils (with copper)
- Min. Core Thickness: 2mils (without copper), 5 mils (with copper)
- Smallest DrillSize: 3 mils (Mechanical), 3 mils (Laser)
- Smallest Finished Hole Size: 2 mils (Mechanical), 2 mils (Laser)
- Vias: Blind, Buried, In Pad, Via fill
-
Largest Panel Size:
22” x 48” {Single-sided & MetalCore PCBs) 22” x 48” {Double-sided PCBs) 22” x 26” (Multi-Layer PCBs)
-
Largest Panel Size :
22” x 48” {Single-sided & MetalCore PCBs) 22” x 48” {Double-sided PCBs) 22” x 26” (Multi-Layer PCBs)
-
Materials :
FR-4 (Low Tg, or High Tg, UL Approved)
Megtron 6
Potyimide
Rogers Ceramic & Duroid
Halogen-free
Taconic Nelco
-
Metal Core:
Aluminium Core 6061
Aluminium Core 5052
Copper Core
Copper-Invar-Copper
-
Hybrids:
Metal-Backed Rogers Duroid
Metal-Backed Robers Ceramics
Metal-Backed FR-4
-
Surface Treatments:
HASL (lead or lead-free):
ENIG :
Gold Plating :
Immersion Thin:
Immersion Silver :
OSP
- Layers: 1-40
- Impedance Tolerance : 5%
- Smallest Trace/Space: 3/3 mils Smallest PadSize: 3 mils
- Impedance Control
- Min. Aspect Ratio: 12:1
- LOI Inner/Outer Layer Imaging
- Board Thickness: 20-250 mils
- High Copper Weight
- Minimum 0.4 mm BGA Pitch
- Via Fillconductive/non-conductive
- LOI Solder Mask Registration
- Control Depth Routing
- Plated Edges/Castellation’s
-
Metal Core:
Aluminium Core 6061
Aluminium Core 5052
Copper Core
Copper-Invar-Copper
- Multiple Plating
-
Hybrids:
Metal-Backed Rogers Duroid
Metal-Backed Robers Ceramics
Metal-Backed FR-4
- Minimum Solder Mask Between Pads: 2.5 mils
-
Surface Treatments:
HASL (lead or lead-free):
ENIG :
Gold Plating :
Immersion Thin:
Immersion Silver :
OSP
- Min. Core Thickness: 2mils (without copper), 5 mils (with copper)
- Min. Core Thickness: 2mils (without copper), 5 mils (with copper)
- Smallest DrillSize: 3 mils (Mechanical), 3 mils (Laser)
- Layers: 1-40
- Smallest Finished Hole Size: 2 mils (Mechanical), 2 mils (Laser)
- Layers: 1-40
- Vias: Blind, Buried, In Pad, Via fill
- Layers: 1-40
-
Largest Panel Size :
22” x 48” {Single-sided & MetalCore PCBs) 22” x 48” {Double-sided PCBs) 22” x 26” (Multi-Layer PCBs)
-
Largest Panel Size:
22” x 48” {Single-sided & MetalCore PCBs) 22” x 48” {Double-sided PCBs) 22” x 26” (Multi-Layer PCBs)
-
Materials :
FR-4 (Low Tg, or High Tg, UL Approved)
Megtron 6
Potyimide
Rogers Ceramic & Duroid
Halogen-free
Taconic Nelco
-
Metal Core:
Aluminium Core 6061
Aluminium Core 5052
Copper Core
Copper-Invar-Copper
PCB / PCBA
Machinery for PCB Manufacturing
State-of-the-art machinery ensures precision, efficiency, and high-quality PCB manufacturing to meet diverse
industry demands and evolving technologies.
